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Business · Elon Musk

Musk Claims Accelerated Chip Equipment for Terafab

Elon Musk asserts that key semiconductor suppliers are speeding up deliveries to support an ambitious 2028 production target for the Texas-based chip foundry.

By Joseph Jenkins ·

Illustration for: Musk Claims Accelerated Chip Equipment for Terafab
Illustration generated for this article, not a news photograph.

One terawatt. That is the annual output of AI computing power Elon Musk claims his new Terafab facility will eventually produce, a figure that would place the commercial value of the Texas plant within the top 20 global economies by GDP. On October 20, during a live broadcast of SpaceX’s third-quarter 2026 earnings call on X, Musk detailed the aggressive timeline for this joint venture between Tesla and SpaceX. The goal is to manufacture logic, memory, and advanced packaging in a single vertically integrated facility, with volume production at the primary site in Gibbons Creek, Texas, targeted for the third or fourth quarter of 2028.

The project’s financial and industrial scale is immense. The facility is described as a multi-billion-dollar endeavor aiming to mitigate future shortages of cutting-edge AI processors. To achieve the 1 TW target, the plant will utilize traditional extreme ultraviolet lithography systems based on Intel’s 14A manufacturing node. Intel officially joined the venture in April 2026 to co-develop and refactor silicon fabrication technology, providing access to this state-of-the-art process. The sheer magnitude of the output is highlighted by the fact that Switzerland, the 20th largest economy on the global list, has a GDP of approximately $1.14 trillion.

Musk stated that critical equipment suppliers, including ASML, have expedited shipments to support this compressed schedule. He emphasized that the dates are "highly aspirational" and carry "big error bars," acknowledging the risk involved. ASML, the world’s sole commercial supplier of the $400 million EUV lithography systems required for leading-edge production, is considered the most critical partner in the supply chain. While unofficial sources previously indicated that the first EUV tool was slated for delivery in mid-2027, it remains unclear if this specific date reflects the accelerated timeline Musk referenced in his announcement.

Beyond the lithography systems, the project relies on a broad network of equipment manufacturers. American firms Applied Materials, Lam Research, and KLA Corporation, along with Japan’s Tokyo Electron, are providing front-end processing, metrology, and process control machinery. Additionally, Tesla and SpaceX are in discussions with approximately 10 South Korean equipment makers, including Hanmi Semiconductor and HPSP, for advanced packaging, high-pressure hydrogen annealing, and specialized piping components. This complex supply chain is essential for building a facility that aims to produce chips for xAI clusters, self-driving vehicles, Optimus humanoid robots, and SpaceX’s orbital AI data center.

In parallel with Terafab, Musk outlined significant expansion plans for his AI computing capacity. He expects 2.5 to 3 gigawatts of computing capacity to be active by the end of 2026. Furthermore, he expressed high confidence in bringing an additional 10 gigawatts online in 2027, suggesting a total of 13 gigawatts of AI compute by the end of that year. To support this growth, SpaceX and xAI are aggressively procuring next-generation NVIDIA architecture, with plans to bring a 440,000-GPU Nvidia "Vera Rubin" training cluster online by the end of the second quarter of 2027.

These targets are ambitious when compared to industry peers. The restructured 10 gigawatt Project Stargate is expected to reach full capacity in the 2030s, a timeline similar to Meta’s 5 gigawatt Hyperion project. Musk’s timeline for Terafab is notably more aggressive, aiming for volume production by late 2028, whereas other major AI infrastructure projects are looking at the next decade. The rapid pace of development suggests a strategic move to secure internal chip supply before external foundries can meet the projected demand.

Despite the optimism, experts have questioned the feasibility of the 1 terawatt ambition. Research firm Gartner estimates that the total global AI-optimized data center capacity is roughly 44 gigawatts as of late 2026. This means Terafab’s planned output would be equivalent to more than 22 times the current global total. According to EpochAI, global AI computing capacity has grown by roughly 3.3 to 3.4 times per year since 2022, indicating rapid expansion, but the jump to 1 terawatt remains a monumental step for a single facility.

The stakes for the project are high, as it represents a major shift toward internal manufacturing for Musk’s ecosystem. The first experimental test chip is expected to be manufactured at the research fabrication facility in Austin, Texas, around the second quarter of 2027. If successful, Terafab could reduce reliance on external foundries like TSMC. However, the success of the project hinges on the ability of suppliers to maintain their accelerated delivery schedules and on the facility meeting its "aspirational" milestones without significant delays.

Source: Tom's Hardware · original report published

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